Heat Sink Optimization for medical system
Medical system Heat Sink changing from water cooling to air cooling and fins Optimization.
A medical system includes an impaction system. This system must be kept in constant temperature in order to get the best results. At first it was designed to be cooled by water, the cooling system then not so compact.
CAS design an air cooling system (part of it can be seen below), with Coolit (a software product of Daat Research Corp), which in one hand is very compact and by other hand kept the temperatures at the desired tolerance of 1 oC.
http://cas.co.il/successes-stories/thermal#sigProGalleria616c3efedb
Optic system tight Optimization
An optic system that includes 2 cameras and a TEC cooled laser, thermally designed to work with the USB limits 2.5 W
A “camera” system includes 2 cameras and a laser, the system detects person location and moving in order to operate the television and the television games.
The system is operated by USB which is limited to 2.5 W , the laser mast maintain at 35 oC , it is done via a TEC ( Thermo electric cooling), the cooling effect can be seen at the figure below. The constrain were the limited cooling area for the TEC as well as the limited power for operating the electronic devices (cameras, laser, chips ...) .
The targets were achieved via thermal simulation with Coolit (a software product of Daat Research Corp) and based on the results, the first Microsoft “kinect” was designed.
http://cas.co.il/successes-stories/thermal#sigProGalleria3dd8fc0925
1U optic Electronic System
A 19” 1U telecom chassis has too cool a high power 80 W component as well as other system components.
The system is a Telecom 1U (44 mm) height, 19" wide "chassis. its includes 2 power supply, 1 main electronic component with more the 80 W, some other electronic components and some optic active connector at the front.
The system was design to operate at two air direction (front–back or back-front) the main problem was to implement a cooling solution to the main component as well as for the sensitive optic connectors.
The main Haet sink was design is such dimension that it offer the air to pass through the Heat Sink, and to cool the 80 W components and in the same time to enable sufficient air to all other components. the simualtion done with Coolit (a software product of Daat Research Corp)
CAS services can, also, reduce your development costs and time to market.
http://cas.co.il/successes-stories/thermal#sigProGalleria6eba6cc5c2
Die Level simulation for a Led
A led simulation was done in order to optimize the structure sizes and thermal resistances as well as the PCB concoction.
The figures show only the led internal parts, the plastic cover is hidden. The thermal design and simulation target were to find: the material and size as well as to reduce the thermal resistances.
The led is connected to one leg which is the one that supply part of the voltage and the other leg which is the other voltage. Some work was done to improve the concoction to the PCB as well.
http://cas.co.il/successes-stories/thermal#sigProGalleria4e4d6d10f6
Optimization fins Pitch (Distance) at an ODU Telecom Antenna
An ODU antenna has to be cooled, CAS prove to the customer what are the optimal distances between the fins
The system is an ODU Antenna. The main internal modules are: the digital and the RF cards and 2 other units. The total power is about 160W.
The customer needed a prove that the heat sink fins space are at the optimal distance to cool his system. Since other system he saw the fins were closer.
By this simulation, which done by Coolit (a software product of Daat Research Corp), it can be seen that that the optimal cooling is achieving at a 12 mm space, which is similar to the optimum presented at David Steinberg book.
Fins: thickness 3 mm ,height 40 mm Optimum at about 15 mm pitch – 12 mm space
http://cas.co.il/successes-stories/thermal#sigProGalleria4811906a6b
6U telecom chassis 6KW heat dissipation
CAS helped one of its customers to develop a 6U telecom chassis The system dissipates about 6KW heat load which area the high end heat dissipations telecom systems
CAS help one of its customer to develop a 6U telecom chassis, the system dissipate about 6KW heat load which area the high end heat dissipations telecom systems
CAS help one of its customer to develop a 6U telecom chassis, the system dissipate about 6KW heat load. At an ambient temperature base on the NBSE standard of Ta=55°C.
The system contained 4 line cards about 1 KW each, the cards are placed with sensitive optic modules as well as other ASIC and DC-DC components.
The amount of power that needs to be cooled is very challenging compare to the unit sizes. this final design meet the requirement needed at the most sensitive components, the optics , as well as for the all other ASIC.
All the simaulation above were done with Coolit (a software product of Daat Research Corp)
http://cas.co.il/successes-stories/thermal#sigProGalleria80f079d273