CAS - Computerized Analysis & Simulation Ltd

Die Level simulation for a Led

A led simulation was done in order to optimize the structure sizes and thermal resistances as well as the PCB concoction.

The figures show only the led internal parts, the plastic cover is hidden. The thermal design and simulation target were to find: the material and size as well as to reduce the thermal resistances.
The led is connected to one leg which is the one that supply part of the voltage and the other leg which is the other voltage. Some work was done to improve the concoction to the PCB as well.